Production challenges of making an EUV mask blank Conference Paper uri icon


MeSH Major

  • Cell Transformation, Viral
  • Oncogenes
  • Receptors, Cell Surface


  • Mask Blanks for EUV Lithography require a lot of new properties and features compared to standard COG blanks. Starting from completely new low thermal expansion substrate materials with significantly improved surface quality over multilayer coatings for EUV reflection, buffer layers, up to new absorber layers with improved dry etching and inspection properties. This papers introduces in the special features of Low Thermal Expansion Materials (LTEM), their manufacturing and the special metrology for the Coefficient of Thermal Expansion (CTE). We will look into some details of polishing methods for much better flatness of the substrates. The process and the metrology of low defect EUV multilayer coatings will be elucidated and some aspects of this will be explained in detail. In addition we will present new results from no-chrome alternative absorber materials.

publication date

  • August 18, 2004



  • Conference Paper


Digital Object Identifier (DOI)

  • 10.1117/12.568007

Additional Document Info

start page

  • 94

end page

  • 104


  • 5504